| Management number | 211036655 | Release Date | 2026/04/04 | List Price | $36.00 | Model Number | 211036655 | ||
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BGA25 OPEN TOP burn in socket pitch 0.5mm IC size 2.951x2.757mm BGA25(2.951x2.757)-0.5 BGA25 VFBGA25 burn in programmer socket Specifications: Part number:BGA25(2.951x2.757)-0.5-TP01NT IC Package includes:BGA25 , VFBGA25 Pin Pitch:0.5mmPin Count:25pinsIC Size:2.951x2.757mmStructure:OPEN-TOP Material & Performance: socket Body: PEIContacts:Beryllium Copper AlloyContact Plating:Gold over NickelOperation Force:2.0KG min, the more PINs the greater force.Contact Resistance:50m maxDielectric:700V AC for 1 minuteInsulation Resistance:1,000M 700V DCMax Current Capacity : 1ATemperature Rating:-55~+175Life Span 25,000 Times (Mechanical)A:Tips:, ,please leave message to us.Thanks. B.BGA socket New creation a.connect with PCB ways Innovation Welding structure : No need of welding structure:Way:Fix by welding Way:Fix by 4 screwsPin length1.83mm Pin length0.25mmTwo structure Features:1.Welding structure :Adopt traditional welding type to fix the socket and PCBA board , stable but waste time andeffort , and once the socket is welded , it cant be recycle .2.No need of welding structure :Adopt innovative screws locking type to fix the sockets and PCBA board , make sure contact isstable , meantime shorten the assembly time , time-saving and reduce effort , and socketcan be removed from the PCBA board , recycle and reduce test cost . b.Connect with IC ways Innovation 1.Open-top/Clamshell structure2.Accommodates pitch :4/0.5/0.65/0.8/1.0mm3.Compact size and low Actuation Force4.Field exchangeable package location plate5.Ucontact support any type of solder ball shapeBall\\no ball\\damaged ball,the drop of contactsurface is more than 0.2mm C.HD picture to
| Brand Name | Generic |
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| Manufacturer | CHIKIMIKI |
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